The IEEE Continuing Education Travel Award



Stipend to attend the SLA Annual Meeting. IEEE, the Institute of Electrical and Electronic Engineers, is sponsoring for SLA Engineering Division members a travel stipend up to $1000 toward payment of expenses incurred while attending a Continuing Education or Engineering Division sponsored course offered at the SLA Conference in Baltimore, MD. This award will be presented at the Engineering Division awards event at the SLA Conference in Baltimore, MD.  Award winners will receive ONE complementary ticket to the awards event.

Qualifications:
  1. Be a member of the SLA Engineering Division in good standing at the time of applying for the award.
  2. Submit a personal statement up to 1000 words explaining how you expect to benefit professionally from a continuing education or Engineering Division course at the annual conference.
Instructions for submission: Submit your application by February 28, 2019. Provide your name, address, telephone number, and email address, and statement to: Barbara Williams (barbaraw@mit.edu). Notification: Applicants will receive notification on award status by early to mid-March.

The award check will be presented at the SLA conference. The award recipient’s name will be posted to the Engineering Division’s website. An announcement and introduction of the award recipient will be posted to the Engineering Division website, appear as an article in the Sci-Tech News. The award winner will be required to submit an article for the Engineering Division Newsletter, Sci-Tech News, within twelve months of completion on how the course helped them professionally.